Integrated circuit coolant microchannel with compliant cover
Publication Type
Patent
Date Published
08/2007
Authors
Myers, Alan M., Je-Young Chang, Ravi S. Prasher, Ioan Sauciuc, Gregory M . Chrysler, Patrick D Boyd, Chia-Pin Chiu
Abstract
An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a cover positioned on the microchannel structure to define a respective upper wall of each of the microchannels. The cover presents a compliant surface to the microchannels.
Year of Publication
2007