Surface chemistry and characteristics based model for the thermal contact resistance of fluidic interstitial thermal interface materials

Publication Type

Journal Article

Date Published

02/2001

Authors

DOI

Abstract

Microprocessor powers are increasing at a phenomenal rate, which requires very small thermal resistance between the die (chip) and the ambient, if the current economical methods of conduction and convection cooling are to be utilized. A typical thermal solution in …

Journal

J. Heat Transfer

Year of Publication

2001

Organization

Research Areas