Publications

X Author: Ravi S Prasher

2004

Patterson, M K, Xiaojin Wei, Y Joshi, and Ravi S Prasher."Numerical study of conjugate heat transfer in stacked microchannels."The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) 1 (2004) 372–380 Vol.1. DOI(link is external)
Kramer, Theresa A, Roger D Flynn, David W Fogg, Evelyn N Wang, Carlos H Hidrovo, Kenneth E Goodson, Ravi S Prasher, David Chau, and Sridhar Narasimhan."Microchannel Experimental Structure for Measuring Temperature Fields During Convective Boiling."ASME 2004 International Mechanical Engineering Congress and Exposition (2004) 699–705. DOI(link is external)
Prasher, Ravi S, and J C Matayabas."Thermal contact resistance of cured gel polymeric thermal interface material."IEEE Trans. Compon. Packag. Technol. 27 (2004) 702–709. DOI(link is external)
Mahajan, Ravi, Chia-Pin Chiu, and Ravi S Prasher."Thermal interface materials: a brief review of design characteristics and materials."Electronics Cooling (2004).
Prasher, Ravi S."Thermal Management."The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) 1 (2004) xix–744. DOI(link is external)
Prasher, Ravi S."Thermal transport cross section and phase function of longitudinal phonons for scattering by nanoparticles and microparticles."J. Appl. Phys. 96 (2004) 5202–5211. DOI(link is external)
Prasher, Ravi S."Thermoelectrically cooling electronic devices." (2004).

2003

Prasher, Ravi S, Abhay A Watwe, Gregory M Chrysler, Kristopher J Frutschy, Leo Ofman, and Ajit Sathe V."Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment." (2003).
Cho, Eun Seok, Jae-Mo Koo, Linan Jiang, Ravi S Prasher, Min Soo Kim, J G Santiago, T W Kenny, and Kenneth E Goodson."Experimental study on two-phase heat transfer in microchannel heat sinks with hotspots."Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003. (2003) 242–246. DOI(link is external)
Prasher, Ravi S."Phonon Transport in Anisotropic Scattering Particulate Media."ASME 2003 International Mechanical Engineering Congress and Exposition (2003) 275–283. DOI(link is external)
Prasher, Ravi S."A simplified conduction based modeling scheme for design sensitivity study of thermal solution utilizing heat pipe and vapor chamber technology."J. Electron. Packag. (2003). DOI(link is external)
Frutschy, Kristopher J, Ravi S Prasher, Eric Distefano, and Ajit Sathe V."Direct heatpipe attachment to die using center point loading." (2003).
Prasher, Ravi S, P Koning, J Shipley, and others others."Dependence of thermal conductivity and mechanical rigidity of particle-laden polymeric thermal interface material on particle volume fraction."Journal of (2003). DOI(link is external)
Prasher, Ravi S."Generalized equation of phonon radiative transport."Appl. Phys. Lett. 83 (2003) 48–50. DOI(link is external)
Sathe V, Ajit, Michael J Witherspoon, Ravi S Prasher, and Kristopher J Frutschy."Electronic assembly having a heat pipe that conducts heat from a semiconductor die." (2003).
Watwe, Abhay A, and Ravi S Prasher."Thermal cooling apparatus." (2003).
Prasher, Ravi S, J Shipley, S Prstic, and others others."Thermal resistance of particle laden polymeric thermal interface materials."ASME 2003 (2003). DOI(link is external)

2002

Jiang, Linan, Jae-Mo Koo, Evelyn N Wang, Abdullahel Bari, Eun Seok Cho, Wendy Ong, Ravi S Prasher, James G Maveety, Min Soo Kim, Thomas W Kenny, Juan G Santiago, and Kenneth E Goodson."Cross-Linked Microchannels for VLSI Hotspot Cooling."ASME 2002 International Mechanical Engineering Congress and Exposition (2002). DOI(link is external)
Prasher, Ravi S, J Shipley, S Prstic, and others others."Rheological Study of Micro Particle Laden Polymeric Thermal Interface Materials: Part 2–-Modeling."ASME 2002 (2002). DOI(link is external)
Prasher, Ravi S, and Dave Payne."Loop heat pipe for mobile computers." (2002).
Prasher, Ravi S."System and method of heat extraction from an integrated circuit die." (2002).
Chrysler, Gregory M, Ravindranath V Mahajan, and Ravi S Prasher."Spreading in the heat sink base: Phase change systems or solid metals??."IEEE Transactions on (2002).
Koo, Jae-Mo, Sungjun Im, Eun Seok Cho, Ravi S Prasher, Evelyn N Wang, Linan Jiang, Abdullahel Bari, David Campion, David W Fogg, Min Soo Kim, Thomas W Kenny, Juan G Santiago, and Kenneth E Goodson."VLSI Hotspot Cooling Using Two-Phase Microchannel Convection."ASME 2002 International Mechanical Engineering Congress and Exposition (2002) 13–19. DOI(link is external)

2001

Devpura, Amit, Patrick E Phelan, and Ravi S Prasher."Size Effects On The Thermal Conductivity Of Polymers Laden With Highly Conductive Filler Particles."Microscale Thermophysical Engineering 5.3 (2001) 177 - 189. DOI(link is external)
Prasher, Ravi S, and Patrick E Phelan."Erratum: "A Scattering-Mediated Acoustic Mismatch Model for the Prediction of Thermal Boundary Resistance'' [ASME J. Heat Transfer, 123, No. 1, pp. 105–112]."Journal of Heat Transfer 123 (2001) 1194–1194. DOI(link is external)