Publications

X Author: Chia-Pin Chiu X Term: Thermal Energy Group

2017

Lu, Daniel, C.P Wong, Ravi S Prasher, and Chia-Pin Chiu."Thermal Interface Materials."Materials for Advanced Packaging (2017) 511 - 535. DOI(link is external)

2008

Gupta, Ashish, Leonel R Arana, David W Song, Chia-Pin Chiu, Ravi S Prasher, Chris Matayabas, and Nirupama Chakrapani."Microelectronic package including thermally conductive sealant between heat spreader and substrate." (2008).

2007

Chang, Je-Young, Ioan Sauciuc, Chuan Hu, Chia-Pin Chiu, Gregory M Chrysler, Ravi S Prasher, Rajiv K Mongia, Himanshu Pokharna, and Eric Distefano."Integrated circuit coolant microchannel assembly with targeted channel configuration." (2007).
Myers, Alan M, Je-Young Chang, Ravi S Prasher, Ioan Sauciuc, Gregory M Chrysler, Patrick D Boyd, and Chia-Pin Chiu."Integrated circuit coolant microchannel with compliant cover." (2007).

2005

Prasher, Ravi S, Chia-Pin Chiu, and Himanshu Pokharna."Thermal management arrangement with channels structurally adapted for varying heat flux areas." (2005).

2004

Mahajan, Ravi, Chia-Pin Chiu, and Ravi S Prasher."Thermal interface materials: a brief review of design characteristics and materials."Electronics Cooling (2004).