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About Us +
The Energy Storage and Distributed Resources Division (ESDR) works on developing advanced batteries and fuel cells for transportation and stationary energy storage, grid-connected technologies for a cleaner, more reliable, resilient, and cost-effective future, and demand responsive and distributed energy technologies for a dynamic electric grid.
Research +
We work closely with academic, government and industry partners to conduct foundational and applied research that provides the groundwork for the development of transformative new energy technologies in the areas of energy storage and conversion, electrical grid, advanced materials for the energy infrastructure, science of manufacturing and water-energy nexus.

Visit our focus areas and research groups at the right to find out more.
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Publications

Publications by Category

2003

Prasher, Ravi S."Phonon Transport in Anisotropic Scattering Particulate Media."ASME 2003 International Mechanical Engineering Congress and Exposition (2003) 275–283. DOI

Prasher, Ravi S."A simplified conduction based modeling scheme for design sensitivity study of thermal solution utilizing heat pipe and vapor chamber technology."J. Electron. Packag. (2003). DOI

Frutschy, Kristopher J, Ravi S Prasher, Eric Distefano, and Ajit Sathe V."Direct heatpipe attachment to die using center point loading." (2003).

Prasher, Ravi S, P Koning, J Shipley, and others others."Dependence of thermal conductivity and mechanical rigidity of particle-laden polymeric thermal interface material on particle volume fraction."Journal of (2003). DOI

Prasher, Ravi S."Generalized equation of phonon radiative transport."Appl. Phys. Lett. 83 (2003) 48–50. DOI

Sathe V, Ajit, Michael J Witherspoon, Ravi S Prasher, and Kristopher J Frutschy."Electronic assembly having a heat pipe that conducts heat from a semiconductor die." (2003).

Watwe, Abhay A, and Ravi S Prasher."Thermal cooling apparatus." (2003).

Prasher, Ravi S, J Shipley, S Prstic, and others others."Thermal resistance of particle laden polymeric thermal interface materials."ASME 2003 (2003). DOI

2002

Jiang, Linan, Jae-Mo Koo, Evelyn N Wang, Abdullahel Bari, Eun Seok Cho, Wendy Ong, Ravi S Prasher, James G Maveety, Min Soo Kim, Thomas W Kenny, Juan G Santiago, and Kenneth E Goodson."Cross-Linked Microchannels for VLSI Hotspot Cooling."ASME 2002 International Mechanical Engineering Congress and Exposition (2002). DOI

Prasher, Ravi S, J Shipley, S Prstic, and others others."Rheological Study of Micro Particle Laden Polymeric Thermal Interface Materials: Part 2–-Modeling."ASME 2002 (2002). DOI

Prasher, Ravi S, and Dave Payne."Loop heat pipe for mobile computers." (2002).

Prasher, Ravi S."System and method of heat extraction from an integrated circuit die." (2002).

Chrysler, Gregory M, Ravindranath V Mahajan, and Ravi S Prasher."Spreading in the heat sink base: Phase change systems or solid metals??."IEEE Transactions on (2002).

Koo, Jae-Mo, Sungjun Im, Eun Seok Cho, Ravi S Prasher, Evelyn N Wang, Linan Jiang, Abdullahel Bari, David Campion, David W Fogg, Min Soo Kim, Thomas W Kenny, Juan G Santiago, and Kenneth E Goodson."VLSI Hotspot Cooling Using Two-Phase Microchannel Convection."ASME 2002 International Mechanical Engineering Congress and Exposition (2002) 13–19. DOI

2001

Devpura, Amit, Patrick E Phelan, and Ravi S Prasher."Size Effects On The Thermal Conductivity Of Polymers Laden With Highly Conductive Filler Particles."Microscale Thermophysical Engineering 5.3 (2001) 177 - 189. DOI

Prasher, Ravi S, and Patrick E Phelan."Erratum: "A Scattering-Mediated Acoustic Mismatch Model for the Prediction of Thermal Boundary Resistance'' [ASME J. Heat Transfer, 123, No. 1, pp. 105–112]."Journal of Heat Transfer 123 (2001) 1194–1194. DOI

Prasher, Ravi S, J Shipley, and Amit Devpura."A simplified modeling scheme for design sensitivity study of thermal solution utilizing heat pipe and vapor chamber technology."ASME-PUBLICATIONS-HTD (2001). DOI

Prasher, Ravi S, O Alger, and Patrick E Phelan."A unified macroscopic and microscopic approach to contact conduction heat transfer."2001 National Heat (2001).

Prasher, Ravi S."Surface chemistry and characteristics based model for the thermal contact resistance of fluidic interstitial thermal interface materials."J. Heat Transfer (2001). DOI

Prasher, Ravi S, and Patrick E Phelan."A Scattering-Mediated Acoustic Mismatch Model for the Prediction of Thermal Boundary Resistance."Journal of Heat Transfer 123.1 (2001) 105. DOI

Prasher, Ravi S, P Koning, J Shipley, and others others."Effect of Particle Volume Fraction on the Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material."ASME-PUBLICATIONS (2001).

Reyburn, B A, M Taya, P Koning, and Ravi S Prasher."Prediction of conductivity of composite thermal interface materials using resistor network model."Pacific Rim/International, Intersociety (2001).

Watwe, Abhay A, and Ravi S Prasher."Spreadsheet tool for quick-turn 3D numerical modeling of package thermal performance with non-uniform die heating."ASME-PUBLICATIONS-HTD (2001).

2000

Devpura, Amit, Patrick E Phelan, and Ravi S Prasher."Percolation theory applied to the analysis of thermal interface materials in flip-chip technology."ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) 1 (2000) 21–28. DOI

Devpura, Amit, Patrick E Phelan, and Ravi S Prasher."Percolation theory applied to study the effect of shape and size of the filler particles in thermal interface materials."American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD 366 (2000) 365–371.